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HLMP-RG10
4 mm Super Oval Precision Optical Performance AlInGaP and InGaN LEDs
Data Sheet
SunPower Series HLMP-RG10, HLMP-SG10, HLMP-RL10, HLMP-SL10, HLMP-RD11, HLMP-SD11, HLMP-RL11, HLMP-SL11, HLMP-RM11, HLMP-SM11, HLMP-RB11, HLMP-SB11
Description These Precision Optical Performance Oval LEDs are specifically designed for Full Color/Video and Passenger Information signs. The oval shaped radiation pattern (60 x 120) and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED materials are used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP) for Red and Amber color and Indium Gallium Nitride (InGaN) for Blue and Green. There are two families of red and amber lamps, AlInGaP and the higher performance AlInGaP II. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Designers can select parallel (where the axis of the leads is parallel to the wide axis of the oval radiation pattern) or perpendicular orientation. Both lamps are available in tinted version. Features * Well defined spatial radiation pattern * Viewing angle: major axis 120 minor axis 60 * High luminous output * Two red and amber intensity levels: AlInGaP (bright) and AlInGaP II (brightest) * Colors: 626/630 nm red 590/592 nm amber526 nm green 470 nm blue * Superior resistance to moisture * UV resistant epoxy Benefits * Viewing angle designed for wide field of view applications * Superior performance for outdoor environments * Radiation pattern matched for red, green, and blue for full color sign Applications * Full color signs
CAUTION: The Blue and Green LEDs are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
21.0 MIN. (0.827) 9.50 0.50 (0.374 0.007) 4.0 0.20 (0.157 0.008)
6.30 0.20 (0.248 0.008)
A
1.0 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 0.44 0.20 (0.017 0.008) 2.54 0.30 (0.100 0.012) 0.80 MAX. EPOXY MENISCUS (0.016)
+0.10 0.45 -0.04 +0.004 (0.018 -0.002)
+0.10 0.40 -0 +0.004 (0.016 -0.000)
21.0 MIN. (0.827) 9.50 0.50 (0.374 0.007) 4.0 0.20 (0.157 0.008)
6.30 0.20 (0.248 0.008)
B
1.0 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 0.44 0.20 (0.017 0.008) 2.54 0.30 (0.100 0.012) 0.80 MAX. EPOXY MENISCUS (0.016)
+0.10 0.45 -0.04 +0.004 (0.018 -0.002)
+0.10 0.40 -0 +0.004 (0.016 -0.000)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Device Selection Guide for AlInGaP Color and Dominant Wavelength d (nm) Typ. Red 626 Red 626 Amber 590 Amber 590 Luminous Intensity IV (mcd) at 20 mA Min. Max. 240 240 400 400 680 680 1150 1150
Part Number HLMP-SG10-JM000 HLMP-RG10-JM000 HLMP-SL10-LP0xx HLMP-RL10-LP0xx
Leads with Stand-Offs Yes Yes Yes Yes
Leadframe Orientation Perpendicular Parallel Perpendicular Parallel
Package Drawing A B A B
Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
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Device Selection Guide for AlInGaP II Color and Dominant Wavelength d (nm) Typ. Red 630 Red 630 Red 630 Amber 592 Amber 592 Amber 592 Red 630 Red 630 Red 630 Red 630 Red 630 Amber 592 Amber 592 Amber 592 Amber 592 Amber 592 Luminous Intensity IV (mcd) at 20 mA Min. Max. 240 400 400 180 400 400 240 400 400 520 520 180 180 310 400 400 1150 1150 1150 1150 1150 1150 880 880 520 880 1150 1150
Part Number HLMP-RD11-J0000 HLMP-RD11-LP000 HLMP-RD11-LPT00 HLMP-RL11-H0000 HLMP-RL11-LP000 HLMP-RL11-LPRxx HLMP-SD11-J0000 HLMP-SD11-LP000 HLMP-SD11-LPT00 HLMP-SD11-MN0xx HLMP-SD11-MNTxx HLMP-SL11-H0000 HLMP-SL11-HL0xx HLMP-SL11-KN0xx HLMP-SL11-LP0xx HLMP-SL11-LPRxx
Leads with Stand-Offs Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Leadframe Orientation Parallel Parallel Parallel Parallel Parallel Parallel Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular Perpendicular
Package Drawing B B B B B B A A A A A A A A A A
Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Device Selection Guide for InGaN Color and Dominant Wavelength d (nm) Typ. Green 526 Green 526 Green 526 Blue 470 Blue 470 Blue 470 Luminous Intensity IV (mcd) at 20 mA Min. Max. 400 180 520 180 65 180 1150 -
Part Number HLMP-SM11-LP0xx HLMP-RM11-H00xx HLMP-RM11-M00xx HLMP-SB11-H00xx HLMP-RB11-D00xx HLMP-RB11-H00xx
Leads with Stand-Offs Yes Yes Yes Yes Yes Yes
Leadframe Orientation Perpendicular Parallel Parallel Perpendicular Parallel Parallel
Package Drawing A B B A B B
Notes: 4. The luminous intensity is measured on the mechanical axis of the lamp package. 5. The optical axis is closely aligned with the package mechanical axis. 6. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
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Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin & VF Selections 0: No Color Bin Limitation R: Amber Color Bins 1, 2, 4, and 6 with VF Maximum of 2.6 V T: Red Color with VF Maximum of 2.6 V Maximum Intensity Bin 0: No Iv Bin Limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue D: 630 nm Red G: 626 nm Red L: 590/592 nm Amber M: 526 nm Green Package R: 4 mm 60 x 120 Oval, Parallel S: 4 mm 60 x 120 Oval, Perpendicular
Absolute Maximum Ratings TA = 25C Parameter DC Forward Current[1] Peak Pulsed Forward Current Average Forward Current Reverse Voltage (IR = 100 A) Power Dissipation LED Junction Temperature Operating Temperature Range Storage Temperature Range
Note: 1. Derate linearly as shown in Figures 6 and 7.
Blue and Green 30 mA 100 mA 30 mA 5V 120 mW 130C -40C to +80C -40C to +100C
Amber and Red 50 mA 100 mA 30 mA 5V 120 mW 130C -40C to +100C -40C to +120C
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Electrical/Optical Characteristics TA = 25C Parameter Typical Viewing Angle[1] Major Minor Forward Voltage Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) Amber (d = 592 nm) Blue (d = 470 nm) Green (d = 526 nm) Reverse Voltage Amber and Red Blue and Green Peak Wavelength Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) Amber (d = 592 nm) Symbol 21/2 Min. Typ. 120 60 VF 1.9 2.0 2.02 2.15 3.5 3.5 VR 5 5 PEAK 635 639 592 594 20 - nm Peak of Wavelength of Spectral Distribution at IF = 20 mA 2.4 2.4[2] 2.4 2.4[2] 4.0 4.0 V IR = 100 A V IF = 20 mA Max. Units deg Test Conditions
LED Indicators Parameter Blue (d = 470 nm) Green (d = 526 nm) Spectral Halfwidth Red (d = 626/630 nm) Amber (d = 590/592 nm) Blue (d = 470 nm) Green (d = 526 nm) Capacitance All Colors Thermal Resistance All Colors Luminous Efficacy[3] Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) Amber (d = 592 nm) Blue (d = 470 nm) Green (d = 526 nm)
Symbol
Min.
Typ. 467 524 17 17 20 35
Max.
Units
Test Conditions
1/2
nm
Wavelength Width at Spectral Distribution 1/2 Power Point at I = 20 mA F
C 40 RJ-PIN 240 v 150 155 480 500 70 540
pF C/W lm/W
VF = 0, F = 1 MHz LED Junction-to-Cathode Lead Emitted Luminous Power/ Emitted Radiant Power
Notes: 1. 21/2 is the off-axis angle where the luminous intensity is the on-axis intensity. 2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, VF, is 2.6 V. Please refer to VF Bin Table below. 3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt.
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1.0 BLUE GREEN AMBER RED
50
IF - FORWARD CURRENT - mA
40 RED 30
RELATIVE INTENSITY
0.5
20 AMBER 10
0 400 450 500 550 WAVELENGTH - nm 600 650 700
0 1.0
1.5
2.0
2.5
3.0
VF - FORWARD VOLTAGE - V
Figure 1. Relative intensity vs. wavelength.
Figure 2. Amber, Red forward current vs. forward voltage.
35
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
2.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0 10 20 30 40 50
1.5
30
IF - FORWARD CURRENT
2.0
25 20 15 10 5 0 2.0 2.4 2.8 3.2 3.6 4.0
1.0
1.5
1.0
0.5
0.5
0
0
0
5
10
15
20
25
30
VF - FORWARD VOLTAGE
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
Figure 3. Blue, Green forward current vs. forward voltage.
Figure 4. Amber, Red relative luminous intensity vs. forward current.
Figure 5. Blue, Green relative luminous intensity vs. forward current.
60
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 TA - AMBIENT TEMPERATURE - C 0 20 40 60 80 100 Rj-a = 585 C/W
50 40 30 20 10 0 Rj-a = 585 C/W Rj-a = 780 C/W
TA - AMBIENT TEMPERATURE - C
Figure 6. Amber, Red maximum forward current vs. ambient temperature.
Figure 7. Blue, Green maximum forward current vs. ambient temperature.
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1.0
0.8
RELATIVE INTENSITY
Intensity Bin Limits (mcd at 20 mA) Bin Name Min. 65 85 110 140 180 240 310 400 520 680 880 Max. 85 110 140 180 240 310 400 520 680 880 1150
0.6
D E F G H
-75 -60 -45 -30 -15 0 15 30 45 60 75 90 ANGULAR DISPLACEMENT - DEGREES
0.4
0.2
0 -90
J K L M N P
Figure 8a. Representative spatial radiation pattern for major axis.
Tolerance for each bin limit is 15%.
1.0
VF Bin Table[2]
0.8
RELATIVE INTENSITY
0.6
0.4
Bin Name VA VB VC
Min. 2.0 2.2 2.4
Max. 2.2 2.4 2.6
0.2
Tolerance for each bin is 0.05 V. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories.
0 -90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
ANGULAR DISPLACEMENT - DEGREES
Figure 8b. Representative spatial radiation pattern for minor axis.
Color Bin Limits (nm at 20 mA) Blue Color Range (nm) Bin Min. Max. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0
Tolerance for each bin limit is 0.5 nm.
Green Bin ID 1 2 3 4 5
Color Range (nm) Min. Max. 520.0 524.0 524.0 528.0 528.0 532.0 532.0 536.0 536.0 540.0
Amber Bin ID 1 2 4 6
Color Range (nm) Min. Max. 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5
Tolerance for each bin limit is 0.5 nm. Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representatives for further information.
Tolerance for each bin limit is 0.5 nm.
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Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. Manual Solder Dipping - - 260 C Max. 5 sec Max.
* Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch)
Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time
Note: Refer to application note AN1027 for more information on soldering LED components.
TURBULENT WAVE
250
TEMPERATURE - C
LAMINAR WAVE HOT AIR KNIFE
BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD
200 150
FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
100 50 30 0 10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME - SECONDS
Figure 9. Recommended wave soldering profile.
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For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2793EN 5989-4174EN May 21, 2006

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